錫膏屬于非常粘稠的東西，怎么使用全自動(dòng)點(diǎn)膠機進(jìn)行點(diǎn)錫膏呢？
Solder paste is a very viscous thing, how to use the automatic dispensing machine to point solder paste? 
把錫膏分成A、B、C、D四組。A組錫膏無(wú)流向性，B組錫膏流向性一般，C組錫膏流向性可流動(dòng)，D組錫膏流向性良好。
First, divide the solder paste into four groups: A, B, C and D. The flow direction of solder paste in group A was normal, that in group B was normal, that in group C was flowable, and that in group D was good.
然后采用全自動(dòng)點(diǎn)膠搭載TS7000螺桿閥配TS500R控制器、普通點(diǎn)膠頭和全自動(dòng)點(diǎn)膠機搭載AS9200噴射閥和控制器二種方案進(jìn)行測試。
Then the test was carried out with two schemes: automatic dispensing with ts7000 screw valve and ts500r controller, ordinary dispensing head and automatic dispensing machine with as9200 injection valve and controller.
在測試過(guò)程中發(fā)現A組無(wú)流向性的錫膏用二種方案都沒(méi)有辦法完成點(diǎn)膠。
In the process of testing, it was found that group a solder paste without flow direction could not finish dispensing with either scheme.
B組流向性一般的錫膏用全自動(dòng)點(diǎn)膠機搭載TS7000的螺桿閥和TS500R的控制器，螺桿閥直徑控制在1.3mm，在此配置下點(diǎn)膠效果比較穩定。
In group B, the solder paste with general flow direction is equipped with ts7000 screw valve and ts500r controller, and the screw valve diameter is controlled at 1.3mm. Under this configuration, the dispensing effect is relatively stable.
C組可流向性錫膏用全自動(dòng)點(diǎn)膠機的二種方案進(jìn)行測試，發(fā)現全自動(dòng)點(diǎn)膠機搭載TS7000的螺桿閥和TS500R的控制器，螺桿閥直徑控制在1.3mm，在此配置下點(diǎn)膠效果比較穩定。但全自動(dòng)點(diǎn)膠機搭載AS9200噴射閥和控制器，噴射閥點(diǎn)膠直徑控制在1.5mm發(fā)現噴射閥容易堵塞噴嘴。
Group C flowable solder paste was tested with two schemes of automatic dispensing machine. It was found that the automatic dispensing machine was equipped with ts7000 screw valve and ts500r controller, and the screw valve diameter was controlled at 1.3mm. Under this configuration, the dispensing effect was relatively stable. However, the automatic dispensing machine is equipped with as9200 injection valve and controller, and the dispensing diameter of the injection valve is controlled at 1.5mm. It is found that the injection valve is easy to block the nozzle.
D組流向性良好的錫膏用二種方案進(jìn)行點(diǎn)膠的時(shí)候，點(diǎn)膠效果都比較穩定。
In group D, when the solder paste with good flow direction was dispensing with the two schemes, the dispensing effect was relatively stable.
由此測試可以發(fā)現，用全自動(dòng)點(diǎn)膠機點(diǎn)錫膏的時(shí)候，需要對錫膏進(jìn)行稀釋?zhuān)屍渚邆淞飨蛐?，這樣才可以用全自動(dòng)點(diǎn)膠機進(jìn)行點(diǎn)膠。而且流向性一般的錫膏只能用螺桿閥進(jìn)行操作，流向性比較好的錫膏用噴射閥和螺桿閥都可以點(diǎn)錫膏。
From this test, we can find that when using the automatic dispenser to point the solder paste, we need to dilute the solder paste to make it flow, so that we can use the automatic dispenser for dispensing. And the solder paste with general flow direction can only be operated by screw valve, and the solder paste with good flow direction can be operated by spray valve and screw valve.
全自動(dòng)點(diǎn)膠機根據錫膏特性對點(diǎn)膠設備配件進(jìn)行選擇和參數調整，避免點(diǎn)膠時(shí)出現斷膠、出膠不均勻等現象影響點(diǎn)膠效果，全自動(dòng)點(diǎn)膠機點(diǎn)錫膏的出現，在電子元件點(diǎn)錫膏應用得到了良好的反應。
According to the characteristics of solder paste, the automatic dispenser selects and adjusts the accessories of dispensing equipment to avoid the phenomenon of broken and uneven dispensing, which affects the dispensing effect. The appearance of solder paste in the automatic dispenser has a good response in the application of electronic components.